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Surface mount heat sink for D-PAK (TO-252) package semiconductorssurface mount heatsink 1

Surface mount heat sink for D-PAK (TO-252) package semiconductors remove the heat indirectly without contacting the device like traditional thruhole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink.  
- 0.64 (0.025) Thick Copper, Tin Plated

Part Number
RT1750D00000
 
surface mount diagram 1surface mount diagram 2
surface mount graph
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Surface mount heat sink for D2-PAK (TO-263) package semiconductorssurface mount heatsink 2

Surface mount heat sink for D2-PAK (TO-263) package semiconductors remove the heat indirectly without contacting the device like traditional thru hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. - 0.65 (0.026) Thick Copper, Tin Plated

Part Number
RT1755D00000
 
surface mount diagram 1surface mount diagram 2
surface mount graph
 
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Surface mount heat sink for D3-PAK (TO-268) package semiconductorssurface mount heatsink 3

Surface mount heat sink for D3-PAK (TO-268) package semiconductors remove the heat indirectly without contacting the device like traditional thru hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. - 1.00 (0.039) Thick Copper, Tin Plated

Part Number
RT1760D00000
 
surface mount diagram 1surface mount diagram 2
surface mount graph  
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